Research on soi pressure sensor packaging process 壓力傳感器封裝工藝研究
Much attention has been focused in recent years on the research of fbg sensor package technology and the temperature and strain separation method . these two issues are the key problems for good practical application of the fbg sensors 光纖布拉格光柵傳感器的封裝技術(shù)與測試結(jié)果中的應(yīng)變/溫度效應(yīng)分離技術(shù)都是目前國內(nèi)外研究的熱點,也是光纖布拉格光柵傳感器應(yīng)用于實際工程結(jié)構(gòu)的重要先決條件。